Dongsheng Hejing 3D Integration Chip Project Launches in Lingang
On June 29, 2026, the groundbreaking ceremony for the Dongsheng Hejing 3D Integrated Chip Manufacturing (Phase I) project was held in Shuyuan Town, Lingang Special Area. With a total planned investment of RMB 10 billion in Phase I, the project is spearheaded by Shenghe Jingwei, marking a pivotal step in the company's strategic layout for advanced packaging and 3DIC mass production. The ceremony was attended by Yu Yong, Deputy Secretary of the Lingang Party Working Committee and Party Secretary of Lingang Group; Wu Xiaohua, Deputy Secretary of the Lingang Party Working Committee; Yu Wenjie, Deputy Director of the Shanghai Municipal Commission of Economy and Informatization; and Cui Dong, Chairman and CEO of Shenghe Jingwei.
3DIC Technology: The Core Pathway in the Post-Moore Era
As global AI computing demand continues to surge, traditional chip scaling approaches physical limits. 3DIC (Three-Dimensional Integrated Circuit) technology—through vertical stacking and high-density heterogeneous integration—significantly enhances computing density and data transmission bandwidth while reducing system power consumption. This is widely recognized as the core technological pathway to break through chip performance bottlenecks. The project targets high-performance computing, artificial intelligence, and data center applications, directly addressing the most cutting-edge computing needs in global technological competition. Once completed, it will form a technology synergy and capacity complementarity with Shenghe Jingwei's Jiangyin base, strengthening the company's capability for large-scale delivery in frontier 3DIC technologies and providing stable, reliable one-stop advanced packaging and testing services for the domestic high-end chip industry chain.
Lingang's Integrated Circuit Cluster Effect Materializes
Shanghai Lingang boasts a comprehensive integrated circuit (IC) industry cluster and favorable industrial policies. With this project, Lingang fills a critical gap in advanced packaging, creating synergies with existing wafer fabrication, equipment, and materials companies. Shuyuan Town, as an important carrier area for Lingang's IC industry development, is accelerating its industrial agglomeration. The presence of multiple Lingang Party Working Committee officials at the groundbreaking ceremony underscores the administrative committee's commitment to end-to-end service support—from project signing to construction. As the 3D integrated chip manufacturing project advances, Lingang's IC industry is extending from mere manufacturing toward high-value-added technology services and innovation platforms.
Implications for Private Enterprises
The groundbreaking of the Dongsheng Hejing project offers three key takeaways for private enterprises. First, technology roadmap choices determine a company's competitiveness for the next decade—early positioning in frontier technologies like 3DIC is essential for seizing initiative in the computing era. Second, Lingang Special Area is accelerating the construction of a full IC industry chain ecosystem; private enterprises should actively integrate into this platform, leveraging industrial clustering and policy advantages for leapfrog development. Third, advanced packaging is a high-investment, long-cycle track that demands long-term commitment and sustained R&D investment to build core technology moats. Shenghe Jingwei's decision to deploy a RMB 10 billion project in Lingang reflects the dual dividends of institutional innovation and industrial ecosystem that this reform frontier offers.
Source: Lingang Special Area Administrative Committee Official Website (lingang.gov.cn)